Electronics Materials Analysis and Testing Services

At Anderson Materials Evaluation, we specialize in comprehensive electronics materials analysis, including semiconductor materials testing. We provide precise insights into the properties and behaviors of electronic components.

For more information on our electronics materials testing, check out our page showing all of our services here.

Semiconductor/Electronics Materials Testing

Our capabilities in materials analysis are extensive. We employ advanced techniques such as:

  • Electrical Conductivity Measurements: We assess conductivity, carrier concentration, mobility, and resistivity.
  • XPS or ESCA Analysis: Evaluating multi-layer structures and finding contaminants in materials like silicon nitride and titanium nitride.
  • Wavelength-Dispersive XRF: Measuring elements in coatings, plastics, and circuit boards, including fire-retardants in wire insulation.
  • Infrared Spectroscopy (FTIR): Identifying residues and coatings in electronic components.
  • GC-MS Analysis: Identifying organic components in residues and coatings.
  • Thermal Analysis: Measuring thermal properties using TMA, DSC, TGA, and other techniques.
  • Surface Analysis: Profilometry and microscopy for surface roughness and finding defects.
  • Metallographic, Optical Microscopy, SEM: Conducting cross-section analysis of solder joints, connectors, or ceramic capacitors, finding polysilicon grain sizes, checking for voids in PCB material or solder joints, assessing copper foil layers in PCB materials, and looking at boards or wafers for issues.
  • UV-Vis Reflectivity: Measuring reflectivity as a function of UV and visible light wavelength in coatings and thin films, as well as the index of refraction, and gloss or haze.
  • Laser-Induced Breakdown Spectroscopy (LIBS): Quickly finding the major composition of a material and identifying elements such as aluminum, calcium, sodium, lead, or boron at high concentrations.

Why Choose Anderson Materials Evaluation?

We use the latest technologies to ensure accurate and reliable results in electronics materials analysis. Our services help you understand and enhance the performance of your semiconductor and electronics components.

For more information on our electronics materials testing and semiconductor materials analysis services, contact us today. Our Ph.D scientists will help your business get back on track.

The above pin had a high contact resistance.  We tested black spots on a gold plated pin with XPS and found to be NiO.  Nickel is commonly plated onto copper wire before electroplated gold is applied over the nickel.  If the gold electroplating incorporates too much contamination in the gold layer, easy diffusion paths for nickel to the surface through the low quality gold allow it to seek the oxygen nickel wants much more than gold does.
A stain on a laser diode caused by a bad anti-reflective coating on an optical element.  We tested the stain and the coating with XPS to identify the source of the problem.  The image is a Nomarski differential phase interference contrast image.