Below are some of the examples of thin film analysis performed by our lab.

XPS Analysis (10 nm depth, elemental and chemical bond analysis):

• Surface chemistry and film stoichiometry, especially subject to variation for sputtered or CVD films
• Elemental composition as a function of depth, useful to examine multilayer film structures such as anti-reflective coatings, metallization layers on ceramics for brazing, or coatings such as TiN on biomedical devices
• Interface contamination
• Surface hydration measurements
• Failure analysis of delamination problems
• Determine whether film layers have reacted or boundaries are sharp
• Diffusion as a function of temperature in vacuum
• Reaction of discrete film with other layers or with substrate as a function of temperature, such as due to brazing or soldering
• Reaction of film or multilayered film with heating in various gases
• Surface analysis of polymers, but cannot perform ion etching analysis of polymers

FTIR Analysis (1 – 2 micrometer depth, chemical bond analysis):

• Detect and identify thin organic or polymer film on metal or semiconductor surface
• Identify thin organic film used to prevent reactions of a thin film structure with the environment as in corrosion
• Identify plastic or polymer with metallization film

Thin Film Thickness Measurements:

• Step-height by profilometry or white light interference microscopy
• SEM or metallographic microscopy imaging of cross section
• Depth profile or angle-resolved XPS if very thin

Surface Roughness:

• Substrate surface structure analysis or profilometry
• Nucleating growth of film
• Film as deposited
• Oxidized or reacted film
• Columnar growth surface porosity

Reactivity of Thin Film:

• TGA measurement of film weight gain due to reaction with gas as temperature is increased
• TGA testing of oxidation protection offered to substrate material by thin film or test for reactivity at higher temperatures and examine by XPS afterward
• DSC measurement of exothermal heat of reaction due to reaction of film with substrate or with other layers in multilayer structures, such as for intermetallic phase formation
• DSC measurement of endothermal heat of melting or of crystalline phase changes
• DSC measurement of exothermal heat of reaction with heating in a gas
• XPS substrate element diffusion through film to surface in active atmosphere conditions or upon heating
• Multilayer film interlayer reactions by depth profile XPS with exception of polymers

Electrochemical and Corrosion Testing:

• Corrosion rate measurement for metal films
• Pitting potential measurement for metal films
• Pin-hole detection for all films
• EIS to determine changes of thin film capacitance or resistance which measure water and ion ingression

Cross Section Analysis:

• Thickness measurement
• Grain size and orientation
• Detection of inclusions
• Uniformity
• Observable phases (carbides, intermetallic phases, graphite micro clusters, etc.)

Adhesion Failures:

• Failure analysis of peeled or delaminated thin film for locus of failure and detection of contamination, hydration, reacted layer, or other causes of failure using XPS and FTIR
• Examination with metallographic microscopy or SEM to determine mode and locus of failure