Anderson Materials Evaluation, Inc. has performed many investigations into materials, processing, device, printed circuit board, connector, and packaging issues of the electronics industry. We have identified the cause of anomalous appearance and contamination on semiconductor wafers. AME has applied surface analysis and depth profile analysis to identify problems in the composition of insulating, barrier, bonding transition, and protective films on processed wafers. We identified the causes of bonding problems on device bonding pads.
We found flaws in ceramic capacitors and in transistors. We identified the cause of contamination on contact surfaces, on surface-mount solder arrays, on ceramic hermetic packages, and on printed circuit boards. We have checked through-hole solder joins for voids and contamination. AME has identified mask cleaning problems. We performed failure analysis on delaminating metallization films on wafer, ceramic, and polymer surfaces. We performed analyses of circuit board, connector, and metal hermetic package corrosion problems. We have examined the purity of electroplated gold metallization and cases of out-migration of the electroplate bath contaminants. Characterizations of wafer polishing materials before and after polishing have been provided. Waste products have also been identified from both treatment and downstream water sewer systems.
We have measured the coefficient of thermal expansion (CTE) of devices, integrated circuit packages, and ceramic and metal hermetically sealed packages. AME has determined the glass transition temperature of the plastic encapsulation of IC packages.
AME analysis projects of electronics have been performed for clients in the semiconductor, integrated circuit, satellite electronics, civil and defense aviation, intelligence agencies, biomedical device, optical communications, electric and gas power, manufacturing automation, consumer products, mobile phone, and the warfare department activities. Among our clients are or have been:
| Advanced Technology Materials, Inc. | Miasole |
| Antec, Inc. | Nanoconduction Inc., acquired by Unidym, Inc. |
| Apple, Inc. | Northrop Grumman Electronic Systems |
| Artic Silver, Inc. | Nufern Inc. |
| BAE Systems | Oryx Advanced Materials, Inc. |
| Baltimore Gas & Electric | Paratek Microwave |
| Brighton Technologies Group, Inc. | Paricon Technologies Corp. |
| Brewer Science, Inc. | PATx, Inc. |
| Caliper, a PerkinElmer Company | Petra’s Tech Shop |
| Carlisle Interconnect Technologies | Polycom |
| Compac, Inc. | Powercon Corporation |
| Conexant Systems | PRI Automation Inc. |
| Cornet Technology, Inc. | Raytheon Corp. |
| Corvis, Inc. | Qualcomm MEMS Technologies |
| Cooper Bussmann, Inc. | RF Monolithics, Inc. |
| CTS Corporation | Research in Motion, Paratek Microwave |
| Curtiss-Wright Electro-Mechanical Corp. | Rothfuss Engineering Co. |
| DRS Technologies, Inc. | Schneider Electric |
| Eaton Semiconductor Equipment Div. | Sensorex |
| Ebara Technologies, Inc. | SDM & Associates, Inc. |
| Electronic Systems Inc. | SEAKR Engineering, Inc. |
| Emerson Climate Technologies | Sercel, Inc. |
| Energy Div. of Electro-Mechanical Corporation | Sierra Nevada Corporation |
| Epitaxial Technologies LLC | Silicon Turnkey Solutions Inc. |
| Fibertek, Inc. | Silicone Technology Corp. |
| First Solar Manufacturing | Skyworks Solutions, Inc. |
| Fusite Div. of Emerson Electric Co. | Space Systems/Loral |
| Gigavac, LLC | Spire Corporation |
| GMT Microelectronics | SRI International |
| Harris Corporation | Strube, Inc. |
| Hoya Corporation USA | Sylarus Technologies LLC |
| Inphi Corporation | Synovis Caribe, Inc. |
| Intermolecular, Inc. | TE Connectivity Ltd. |
| Joslyn Electronic Systems | Temp Flex Cable Inc. |
| Kapteyn-Murnane Laboratories Inc. | Thalmic Labs Inc. |
| L3 NARDA MITEQ | Thermo Fisher Scientific Inc. |
| LAM International Corporation | Trace Laboratories, Inc. |
| Lam Research Corporation | Tronics Group |
| Laird Technologies | Trumpf Photonics Inc. |
| Laser Components DG, Inc. | Unitrode Corp. |
| Level 3 (former Corvis) | Varian Semiconductor Equipment |
| Lincoln Electric Company | Vestas – American Wind Technologies, Inc. |
| Littelfuse, Inc. | Voltage Multipliers, Inc. |
| Lockheed Martin Electronic Systems | Wilson Greatbatch Technologies Inc. |
| M.E.C. Tech | WJ Communications Inc. |
| Methode Electronics, Inc. |
Feel free to reach out to us regarding any concerns you may have about your electronics materials. We’re here to assist you!
