Metal Analysis and Testing

At Anderson Materials Evaluation, we offer a vast array or metal analysis and testing services. Here are some of the analysis and testing capabilities we can use to solve your unique metal analysis needs:

WD-XRF for Metal Testing:

  • Quantitatively determine the elemental composition for elements fluorine and heavier
  • Detect and measure very low concentration heavy elements
  • Verify whether a metal is the proper alloy for the application and environment

XPS or ESCA Surface Analysis:

  • Surface contamination detection and identification
  • Surface oxide chemistry
  • Identification of corrosion products
  • Measure Cr to Fe ratio in stainless steel surface oxides to check passivation effectiveness in the base metal, at a weld, and in the Heat Affected Zone (HAZ).
  • Surface segregation of elements in alloys; carbon, sulfur, and phosphorus being examples in addition to metal elements
  • Depth profile elemental analysis to measure graphitic carbon and carbide concentrations as a function of depth
  • Determine the chemistry of anodized surfaces
  • Determine cause of adhesive bond failures on metal surfaces
  • Examine the surface chemistry of metal particles prior to sintering for powdered metallurgy
Metal testing: Treated titanium surface
Treated titanium surface

X-ray Diffraction (XRD) Analysis:

  • Identify and measure the percentage of various metal alloy phases in a metal
  • Determine the surface oxidation or surface treatment products when thick enough
  • Detect and measure the concentration of intermetallic phases
  • Identify corrosion products
  • Distinguish differing quench rates for a metal alloy

Electrochemical Analysis and Corrosion Testing:

FTIR or Infrared Spectroscopy Analysis:

  • Identify organic coatings on metal surfaces
  • Identify organic contaminants on metal surfaces
  • Identify carbonate, sulfate, nitrate, nitrite, phosphate, and hydroxide layers on metal surfaces

DSC Analysis:

  • Determine alloy melting temperature and the heat of fusion if the melting point is below 725°C
  • Measure the heat capacity
  • Determine temperature and exothermal energy of intermetallic phase formation
  • Determine temperature of crystalline structural (shape-memory included) or magnetic phase transformations (curie temperatures)
  • Determine temperature and energy of a precipitation reaction such as those in many aluminum alloys

TGA Analysis:

  • Measure rate of gas reaction with metal as a function of temperature
  • Determine the Curie temperature of magnetization of ferromagnetic materials

TMA Analysis:

  • Measure the rate of thermal expansion as a function of temperature
  • Measure the melting point if it is below 800°C
  • Measure the rate of surface layer growth due to reaction with gas as a function of temperature
  • Determine the temperature of a structural phase change

SEM Analysis:

  • Image surface morphology
  • Determine fracture mode
  • Determine crystalline domain sizes
  • Measure phase distributions and identify phase types
  • Examine oxide structure and growth modes
  • Image wear effects
  • Examine growth modes of deposited films

Cross Section Analysis:

  • Determine cracking modes
  • Determine inclusion content
  • Examine for voids
  • Examine structures for design integrity

Metallographic Analysis or Metallography:

  • Examine grain sizes and shapes
  • Examine phase distribution and identify type
  • Examine coating defects such as holes, pores, and cracks
  • Measure density and type of inclusions
  • Measure density and size of voids
  • Measure the thickness of oxide or surface treatment layers
  • Examine solder and braze joint cross sections for defects
  • Examine the heat-affect zone near welds and brazed joints
  • Determine cracking modes in metals (transgranular, intergranular, etc.)
    [Example: Cross Section Analysis with Intergranular Corrosion]
  • Examine grain by grain variations of oxide thickness on highly oxidized metal surfaces
  • Examine the onset of corrosive reaction or pits
An anodized aluminum sheet surface is shown above as prepared for adhesive bonding.  No primer has been applied to this surface, though one is before adhesive bonding is performed.
An anodized aluminum sheet surface is shown above as prepared for adhesive bonding.  No primer has been applied to this surface, though one is before adhesive bonding is performed.
Pinhole corrosion in copper tubing revealed by Nomarski phase interference contrast microscopy.
Pinhole corrosion in copper tubing revealed by Nomarski phase interference contrast microscopy.

Several examples of metallographic analysis are discussed on this page.

Surface Profilometry and Roughness Measurements:

  • Measure surface roughness parameters
  • Measure the step height at the edge of a metal layer on a PCB or connector

Keyence Microscopy with LIBS Elemental Analysis:

  • Chemical Phase Information
  • Particle Size and Grain Size Analyses
  • Surface Topography Profiles with Surface Roughness Measurement over Lines and Areas
  • LIBS for Elemental Analysis of Small Volumes of Material
Knife Edge 1000X 3D Keyence
Knife Edge 1000X 3D Keyence
Example use of Keyence and LIBs for elemental analysis of an alloy surface. This material shows Tungsten (~67%) and Nickel (~33%).
Example use of Keyence and LIBs for elemental analysis of an alloy surface. This material shows Tungsten (~67%) and Nickel (~33%).

Electrical Conductivity:

For thin metal samples, the Ecopia HMS-3000 Hall Effect Measurement System uses the van der Pauw technique for these measurements, with thickness much smaller than for non-metallic materials:

  • Measure Electrical Conductivity (limited to a few hundred micrometers thickness)
  • Measure Carrier Concentration (less than 20 micrometers thick)
  • Measure Mobility (less than 20 micrometers thick)
  • Measure Average Hall Coefficient (less than 20 micrometers thick)
  • Measure Sheet Concentration (less than 20 micrometers thick)
  • Measure Sheet Resistance (less than 20 micrometers thick)
  • Measure Resistivity (less than 20 micrometers thick)
  • Measure B-D Cross Hall Coefficient (less than 20 micrometers thick)
  • Measure A-C Hall Coefficient (less than 20 micrometers thick)
  • Measure Alpha (Vertical/Horizontal Ratio of Resistance)
  • Measure Magnetoresistance (less than 20 micrometers thick)

Reach out today to explore your metal analysis needs. Our team is happy to collaborate with you in crafting a comprehensive solution tailored to address your specific concerns.