Elemental Composition of Small Volumes of Material
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Capabilities of the LIBS Keyence EA-300 Elemental Analyzer
- Integrated with the Keyence VHX-7000N Digital Microscope, 4K 3D Optical Microscopy
- High power focused 355 nm laser beam ablates a surface area of 10 micrometers diameter
- Crater is usually 5 to 7 micrometers deep — can be deeper for small objects.
- A plasma results and the de-excitation process emits photons characteristic of the emitting elements in the deep ultraviolet, visible, and near infrared range.
- A 1 by 1.8 inch 3.19 megapixel CMOS sensor detects 185 – 960 nm wavelength radiation through a 300X magnification lens over a 16-bit intensity range for the RGB color of each pixel.
- Identifies and measures elements H, Li, Be, B, C, N, O, F, Na, Mg, Al, Si, P, S, and heavier through U.
- Usually does not detect elements at less than 0.5 atomic percent concentration.
- Single shot mode, drilling mode for depth profiling, and multi-spot analysis mode
- Analyzes about 5 times or more deeper volume than EDS does, but is less focused laterally
- Analyzes 250 times or more deeper than XPS analysis and is much more focused laterally
- Analysis is much shallower than XRF for all but the lightest elements, but is much more focused laterally
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Application Notes
Silicon Nitride Ceramic Analysis
Reach out to us today for your elemental analysis needs, and we’ll gladly engage in a conversation about how our cutting-edge analytical tools can effectively address your concerns.