Elemental Composition of Small Volumes of Material
Capabilities of the LIBS Keyence EA-300 Elemental Analyzer
- Integrated with the Keyence VHX-7000N Digital Microscope, 4K 3D Optical Microscopy
- High power focused 355 nm laser beam ablates a surface area of 10 micrometers diameter
- Crater is usually 5 to 7 micrometers deep — can be deeper for small objects.
- A plasma results and the de-excitation process emits photons characteristic of the emitting elements in the deep ultraviolet, visible, and near infrared range.
- A 1 by 1.8 inch 3.19 megapixel CMOS sensor detects 185 – 960 nm wavelength radiation through a 300X magnification lens over a 16-bit intensity range for the RGB color of each pixel.
- Identifies and measures elements H, Li, Be, B, C, N, O, F, Na, Mg, Al, Si, P, S, and heavier through U.
- Usually does not detect elements at less than 0.5 atomic percent concentration.
- Single shot mode, drilling mode for depth profiling, and multi-spot analysis mode
- Analyzes about 5 times or more deeper volume than EDS does, but is less focused laterally
- Analyzes 250 times or more deeper than XPS analysis and is much more focused laterally
- Analysis is much shallower than XRF for all but the lightest elements, but is much more focused laterally
Application Notes
Silicon Nitride Ceramic Analysis
Reach out to us today for your elemental analysis needs, and we’ll gladly engage in a conversation about how our cutting-edge analytical tools can effectively address your concerns.