Anderson Materials Evaluation, Inc. has extensive experience in investigating materials and processing issues within the electronics industry. We have identified causes of anomalous appearances and contamination on semiconductor wafers, and used surface and depth profile analysis to pinpoint problems in insulating, barrier, bonding transition, and protective films on processed wafers. Additionally, we have successfully identified the causes of bonding issues on device bonding pads.
Key Achievements
- Ceramic Capacitors and Transistors: Identified flaws and contamination issues.
- Surface Contamination: Detected contamination on contact surfaces, surface-mount solder arrays, ceramic hermetic packages, and printed circuit boards.
- Solder Joins: Checked through-hole solder joins for voids and contamination.
- Mask Cleaning: Identified problems in mask cleaning processes.
- Failure Analysis: Conducted failure analysis on delaminating metallization films on wafer, ceramic, and polymer surfaces.
- Corrosion Problems: Analyzed circuit board, connector, and metal hermetic package corrosion issues.
- Gold Metallization: Examined purity of electroplated gold metallization and identified out-migration of electroplate bath contaminants.
- Polishing Materials: Characterized wafer polishing materials before and after polishing.
- Waste Products: Identified waste products from treatment and downstream water sewer systems.
Thermal and Mechanical Testing
- Thermal Expansion: Measured the coefficient of thermal expansion (CTE) of devices, integrated circuit packages, and ceramic and metal hermetically sealed packages.
- Glass Transition Temperature: Determined the glass transition temperature of plastic encapsulation in IC packages.
Electronics Client Industries
Our analysis projects span various industries, including:
- Semiconductor
- Integrated circuit
- Satellite electronics
- Civil and defense aviation
- Intelligence agencies
- Biomedical devices
- Optical communications
- Electric and gas power
- Manufacturing automation
- Consumer products
- Mobile phones
- Warfare department activities
Contact Us
For more detailed information about our services or to discuss your specific needs, please visit the electronics page on our website or contact us directly. Our team of experts is ready to assist with your material evaluation and testing requirements.
Notable Clients
Among our clients are some of the leading companies and organizations in these industries.
| Advanced Technology Materials, Inc. | Miasole |
| Antec, Inc. | Nanoconduction Inc., acquired by Unidym, Inc. |
| Apple, Inc. | Northrop Grumman Electronic Systems |
| Artic Silver, Inc. | Nufern Inc. |
| BAE Systems | Oryx Advanced Materials, Inc. |
| Baltimore Gas & Electric | Paratek Microwave |
| Brighton Technologies Group, Inc. | Paricon Technologies Corp. |
| Brewer Science, Inc. | PATx, Inc. |
| Caliper, a PerkinElmer Company | Petra’s Tech Shop |
| Carlisle Interconnect Technologies | Polycom |
| Compac, Inc. | Powercon Corporation |
| Conexant Systems | PRI Automation Inc. |
| Cornet Technology, Inc. | Raytheon Corp. |
| Corvis, Inc. | Qualcomm MEMS Technologies |
| Cooper Bussmann, Inc. | RF Monolithics, Inc. |
| CTS Corporation | Research in Motion, Paratek Microwave |
| Curtiss-Wright Electro-Mechanical Corp. | Rothfuss Engineering Co. |
| DRS Technologies, Inc. | Schneider Electric |
| Eaton Semiconductor Equipment Div. | Sensorex |
| Ebara Technologies, Inc. | SDM & Associates, Inc. |
| Electronic Systems Inc. | SEAKR Engineering, Inc. |
| Emerson Climate Technologies | Sercel, Inc. |
| Energy Div. of Electro-Mechanical Corporation | Sierra Nevada Corporation |
| Epitaxial Technologies LLC | Silicon Turnkey Solutions Inc. |
| Fibertek, Inc. | Silicone Technology Corp. |
| First Solar Manufacturing | Skyworks Solutions, Inc. |
| Fusite Div. of Emerson Electric Co. | Space Systems/Loral |
| Gigavac, LLC | Spire Corporation |
| GMT Microelectronics | SRI International |
| Harris Corporation | Strube, Inc. |
| Hoya Corporation USA | Sylarus Technologies LLC |
| Inphi Corporation | Synovis Caribe, Inc. |
| Intermolecular, Inc. | TE Connectivity Ltd. |
| Joslyn Electronic Systems | Temp Flex Cable Inc. |
| Kapteyn-Murnane Laboratories Inc. | Thalmic Labs Inc. |
| L3 NARDA MITEQ | Thermo Fisher Scientific Inc. |
| LAM International Corporation | Trace Laboratories, Inc. |
| Lam Research Corporation | Tronics Group |
| Laird Technologies | Trumpf Photonics Inc. |
| Laser Components DG, Inc. | Unitrode Corp. |
| Level 3 (former Corvis) | Varian Semiconductor Equipment |
| Lincoln Electric Company | Vestas – American Wind Technologies, Inc. |
| Littelfuse, Inc. | Voltage Multipliers, Inc. |
| Lockheed Martin Electronic Systems | Wilson Greatbatch Technologies Inc. |
| M.E.C. Tech | WJ Communications Inc. |
| Methode Electronics, Inc. |
