Communications Customers

Anderson Materials Evaluation has partnered with customers in the many areas of the communications field, from fiber optics to devices.  Our team has performed materials analyses on devices such as cell phones, wireless communications routers, and conferencing equipment.  We have examined optical fibers and amplifiers, optical mirrors, printed circuit boards and ICs, solder joints, electrical contacts, optical fiber couplers, satellite-based electrical components and packaging, avionics communication equipment, RF and microwave devices, adhesive bonding problems in devices, thermal cooling contact materials, thin film coatings, IC encapsulation plastic thermal properties, degradation due to outgassing materials, degradation due to environmental exposure, IC and PCB thermal expansion measurements, and identifying the cause of high inductive losses in high voltage ceramic insulators.  Please feel free to contact us and discuss other materials analysis needs you may have.

We have done work for many prominent communications companies including Conexant Systems, Polycom, Qualcomm and OFS.

Our communications customers include:

Agiltron CorporationLevel 3 (former Corvis)
BAE SystemsLV Sensors
C&R MachineMerrimac Industries
CienaNufern Inc.
Conexant SystemsOFS, a Fukukawa Company
CorvisPACE PLC
CTS CorporationParatek Microwave
CushcraftPhysical Optics
Dielectric LLCPolycom
Gooch & Housego LLCQualcomm
Harris CorporationResearch in Motion, Paratek Microwave
Inphi CorporationRF Monolithics
International Ceramic EngineeringSkyworks Solutions
ITT Intelligence and Information WarfareSpace Systems/Loral
K&L MicrowaveSparkolor
Kapteyn-Murnane Laboratories Inc.Subsea Environmental Services
Laird TechnologiesViaSat, Inc.
Communications Page- A circuit board for analysis